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Resin-filled board - List of Manufacturers, Suppliers, Companies and Products

Resin-filled board Product List

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Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a circuit board with resin embedded in the through holes and pads placed on top.

This is a circuit board designed to secure the mounting space for components by embedding resin in through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

  • Printed Circuit Board

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Through-hole resin embedded substrate

Through-hole resin embedded substrate

The number of layers ranges from 2 to 20, and there is a proven track record of resin filling up to a thickness of 3.2mm!

We would like to introduce the "Through Resin Filled Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board is mainly used for boards that mount narrow pitch BGA components (such as 0.5 to 0.3 mm pitch) and for the purpose of filling through holes (TH). After filling the holes (primary TH) that need to be resin-filled with a permanent hole-filling ink (epoxy resin), through holes (secondary TH) are formed, and it is also possible to create a cover plating on the primary TH section that has been resin-filled. 【Example of Manufacturing Specifications for Through Resin Filled Circuit Board】 ■ 12-layer through resin filled circuit board with 0.4 mm pitch BGA - Board thickness: t1.6 mm - BGA pad diameter: φ0.32 mm - Resist opening: φ0.25 mm - Resin filled TH drill: φ0.2 mm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Through-hole resin-filled substrate

Through-hole resin-filled substrate

Through-hole resin-filled substrate

This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.

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